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conferenceseries
.com
Volume 6, Issue 4 (Suppl)
Agrotechnology, an open access journal
ISSN: 2168-9881
Agri 2017
October 02-04, 2017
allied
academies
10
th
International Conference on
AGRICULTURE & HORTICULTURE
October 02-04, 2017 London, UK
Usefulness of infra-red thermography as a high-throughput tool for rice heat tolerant selection
Giovani G Brito
1
, Paulo Ricardo Reis Fagundes
1
, Luís Eduardo Panozzo
2
, Sidnei Deuner
2
, Diogo Silva Moura
2
and
Italo Lucas de Moraes
2
1
Embrapa - Brazilian Agricultural Research Corporation, Brazil
2
UFPel – Universidade Federal de Pelotas, Brazil
R
ice (
Oryza sativa L
.) is sensitive specie to extreme temperatures, especially at reproductive phase. Although their genome
has been completely sequenced opening wide opportunities for large-scale studies in mapping and functional genomics,
physiological phenotyping under field condition still is the major bottleneck to associate a specific genotype to a phenotypic
trait. Thus, a set of 182 accessions involving subspecies indica, japonica and indica/japonica cross were evaluated under field
conditions in two sowing date representing contrasting environments temperatures for rice growth. At second time sowing
the occurrence of supra-optimal temperatures at the reproductive phase decreased significantly the mean grain yield (12%). A
hierarchical clustering analysis highlighted that Cluster VI had outperforming LTB 14033 genotype; the grain per panicle and
grain yield per square meter were the most closely related traits by principal components analysis (PCA); the thermography
analysis highlighted that this genotype showed lower leaves temperatures, approximately 1°C less than mean shown by set of
evaluated genotypes. In addition, PCA revealed an important role for leaves dissipation capability of thermal energy and its
association with grain yield and that the use of non-invasive phenotyping approach via thermography correlated negatively
and significantly with grain yield of set evaluated accessions.
giovani.brito@embrapa.brAgrotechnology 2017, 6:4(Suppl)
DOI: 10.4172/2168-9881-C1-028