Research Article
Fabricating Functional Ti-Alloy Biomedical Implants by Additive Manufacturing Using Electron Beam Melting
Lawrence E Murr1,2*, Sara M Gaytan1,2, Edwin Martinez1,2, Frank R Medina2 and Ryan B Wicker21Department of Metallurgical and Materials Engineering, The University of Texas at El Paso, El Paso, TX 79968, USA
2W. M. Keck Center for 3D Innovation, The University of Texas at El Paso, El Paso, TX 79968, USA
- Corresponding Author:
- Dr. Lawrence E Murr
Department of Metallurgical and Materials Engineering
The University of Texas at El Paso
El Paso, TX 79968, USA
Tel: +915-747-6929
Fax: +915-747-8036
E-mail: lemurr@utep.edu
Received date: March 07, 2012; Accepted date: March 24, 2012; Published date: March 26, 2012
Citation: Murr LE, Gaytan SM, Martinez E, Medina FR, Wicker RB (2012) Fabricating Functional Ti-Alloy Biomedical Implants by Additive Manufacturing Using Electron Beam Melting. J Biotechnol Biomaterial 2:131. doi:10.4172/2155-952X.1000131
Copyright: © 2012 Murr LE, et al. This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.
Abstract
A wide range of biocompatible and biofunctional implant devices from dental screw posts to porous hip stems designed for stress compatibility, cementless fixation by bone cell ingrowth, and long-term infection defense employing antibacterial, nanoparticulate silver are illustrated in this review of contemporary biomaterial appliances. Emphasis is placed on Ti-6Al-4V, but new alloys providing low Young’s modulus for stress-shielding reduction as well as Co-base alloys are highlighted. Open-cellular structure monoliths fabricated by additive manufacturing using electron beam melting are illustrated along with observations of their microstructures observed by light optical and electron microscopies and associated mechanical properties; including hardness, tensile and fatigue strength.