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Stephens Dang

School of Computing and Engineering, University of Huddersfield, United Kingdom
Publications

Exploration of Thermal Impacts in Bulk Oxide Chemical Mechanical Polishing

Chemical mechanical polishing (CMP) is a vital process in semiconductor manufacturing for achieving surface planarity and smoothness. Thermal effects during bulk oxide CMP play a significant role in process performance, influencing material removal rates, surface quality, and overall efficiency. This article explores the thermal impacts in bulk oxi... Read More»

Stephens Dang

: Ind Chem

Abstract Peer-reviewed Full Article Peer-reviewed Article PDF Mobile Full Article

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