ISSN: 2277-1891

International Journal of Advance Innovations, Thoughts & Ideas
Open Access

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Elenti Petkert

Infrastructure development, construction, and urban planning, Kazakh National Technical University, Kazakhstan
Publications

3D Chip Stacking: Revolutionizing Semiconductor Design for Higher Performance and Efficiency

3D chip stacking is a cutting-edge technology in the semiconductor industry that aims to overcome the limitations of traditional 2D integrated circuits. By vertically stacking multiple layers of chips and interconnecting them, 3D chip stacking promises to significantly enhance the performance, reduce the size, and lower the power consumption of ele... Read More»

Elenti Petkert

: Int J Adv Innovat Thoughts Ideas: 13:6: 301

10.4172/2277-1891.1000301

Abstract Peer-reviewed Full Article Peer-reviewed Article PDF Mobile Full Article

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